Title:
METHOD FOR MANUFACTURING INFRARED CUT-OFF FILTER, FILTER FOR SOLID-STATE IMAGING ELEMENT, AND SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/132492
Kind Code:
A1
Abstract:
The present invention includes: forming an infrared cut-off layer containing an infrared absorbing pigment; forming a protective layer against a peeling solution on the infrared cut-off layer; forming a resist pattern on the protective layer; patterning the protective layer and the infrared cut-off layer through dry etching by using the resist pattern; and peeling the resist pattern from the protective layer by using the peeling solution.
Inventors:
IWATA REIKO (JP)
HIRAI YURI (JP)
AKENO YASUTAKE (JP)
HIRAI YURI (JP)
AKENO YASUTAKE (JP)
Application Number:
PCT/JP2020/048516
Publication Date:
July 01, 2021
Filing Date:
December 24, 2020
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
G02B5/22; H01L27/146
Domestic Patent References:
| WO2018174147A1 | 2018-09-27 |
Foreign References:
| US20180076258A1 | 2018-03-15 | |||
| US20180315791A1 | 2018-11-01 | |||
| JP2017036457A | 2017-02-16 | |||
| JP2019174813A | 2019-10-10 | |||
| JP2020122902A | 2020-08-13 |
Other References:
See also references of EP 4083667A4
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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