Title:
METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND FILM FORMING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/234108
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a method for manufacturing a laminate without the need for a metal mask or etching, thereby having an improved film formation efficiency; a method for manufacturing a semiconductor device; and a film forming apparatus. The present invention relates to a method for manufacturing a laminate including a substrate and a film, the method being characterized by comprising: (1) a step for bringing an opening of a container into contact with one main surface side of the substrate; (2) a step for introducing a gas containing a raw material for film formation into the container; and (3) a step for forming the film on the one main surface side of the substrate by bringing the gas containing a raw material for film formation into contact with the one main surface side of the substrate.
Inventors:
OKUYAMA TETSUO (JP)
TOKUDA KAYA (JP)
MATSUO KEISUKE (JP)
TAKIMOTO NAOMI (JP)
TOKUDA KAYA (JP)
MATSUO KEISUKE (JP)
TAKIMOTO NAOMI (JP)
Application Number:
PCT/JP2023/019053
Publication Date:
December 07, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B05D7/00; B05B1/00; C23C16/44; H01L21/31; H01L21/365; H01L21/368
Foreign References:
| JP2012256637A | 2012-12-27 | |||
| JP2011224503A | 2011-11-10 | |||
| JP2004335892A | 2004-11-25 | |||
| JPH0633244A | 1994-02-08 | |||
| JPH09246193A | 1997-09-19 | |||
| JPH10306373A | 1998-11-17 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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