Title:
RESIN COMPOSITION FOR INJECTION MOLDING, INJECTION-MOLDED ARTICLE, METHOD FOR MANUFACTURING INJECTION-MOLDED ARTICLE, AND METHOD FOR ANALYZING INJECTION-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/234107
Kind Code:
A1
Abstract:
The present invention estimates resin alignment while suppressing anisotropy. A resin composition for injection molding according to the present invention comprises a first thermoplastic resin and a filler that contains non-fibrous first inorganic particles. This resin composition is characterized by: further comprising an aggregate of second inorganic particles and/or a resin composition of second thermoplastic resin; the aggregate and the resin composition being configured such that, regarding the dimensions of the aggregate and the resin composition in three directions intersecting one another at a right angle, the ratio between a first length, which is the longest, and a second length, which is the shortest, is 2-20; the first length being 25-100 μm; and the aggregate or the resin composition not including inside thereof the first inorganic particles each having a particle diameter of at least 25 μm.
Inventors:
MIURA TAKAHIRO (JP)
YAMAZAKI TAKANORI (JP)
HANDA MASAHIRO (JP)
TSUKAMOTO MASAYOSHI (JP)
YAMAZAKI TAKANORI (JP)
HANDA MASAHIRO (JP)
TSUKAMOTO MASAYOSHI (JP)
Application Number:
PCT/JP2023/018994
Publication Date:
December 07, 2023
Filing Date:
May 22, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B29C45/00; B29C45/76
Domestic Patent References:
| WO2012050083A1 | 2012-04-19 |
Foreign References:
| JP2016533282A | 2016-10-27 |
Attorney, Agent or Firm:
OKABE, Yuzuru et al. (JP)
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