Title:
METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2024/009993
Kind Code:
A1
Abstract:
This method of manufacturing a laminate that has a surface-modified layer and a semiconductor substrate comprises: a first step in which a semiconductor substrate is coated with a surface modifier containing a polymer and a solvent, and then the substrate is fired to crosslink the polymer and obtain a surface-modified layer precursor; and a second step in which the surface-modified layer precursor is thinned by bringing the surface-modified layer precursor into contact with a thinning liquid to obtain a surface-modified layer having a thickness of 5 nm or less.
Inventors:
SHIBAYAMA WATARU (JP)
SHIGAKI SHUHEI (JP)
TAKEDA SATOSHI (JP)
FURUKAWA YUKI (JP)
SAIJO TAIKI (JP)
SHIGAKI SHUHEI (JP)
TAKEDA SATOSHI (JP)
FURUKAWA YUKI (JP)
SAIJO TAIKI (JP)
Application Number:
PCT/JP2023/024742
Publication Date:
January 11, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C08G77/02; C08G77/04; C08L83/04; C08L101/00; C09D183/04; G03F7/20; H01L21/027
Foreign References:
| JP2017068049A | 2017-04-06 | |||
| JP2021148831A | 2021-09-27 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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