Title:
METHOD FOR MANUFACTURING LAMINATE, LAMINATE, AND TOUCH SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/117668
Kind Code:
A1
Abstract:
The present invention provides: a method for manufacturing a laminate that has superior connection reliability between transparent conduction parts; a laminate; and a touch sensor. The method for manufacturing a laminate comprises: a step 1 for disposing a photosensitive composition layer on a transparent conductive part side of a conductive substrate that has a base material and a transparent conductive part disposed on the base material; a step 2 for performing pattern exposure on the photosensitive composition layer via a first exposure mask from the base material side of the conductive substrate; a third step for performing a development process on the pattern-exposed photosensitive composition layer and forming a cured layer that has a plurality of opening sections from which at least a portion of the transparent conductive part is exposed; and a step 4 for forming, on the cured layer, a conductive part that causes the transparent conductive part exposed from the plurality of opening sections to be electrically connected to each other.
Inventors:
ISHIZAKA SOJI (JP)
KANNA SHINICHI (JP)
KANNA SHINICHI (JP)
Application Number:
PCT/JP2020/045439
Publication Date:
June 17, 2021
Filing Date:
December 07, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/09; G03F7/20; G03F7/40; G06F3/041; G06F3/044; H01B5/14; H01B13/00; H05K3/00
Domestic Patent References:
| WO2018186428A1 | 2018-10-11 |
Foreign References:
| JP2016200615A | 2016-12-01 | |||
| JP5224203B1 | 2013-07-03 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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