Title:
METHOD FOR MANUFACTURING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/202921
Kind Code:
A1
Abstract:
The present invention addresses the purpose of providing a novel method for manufacturing a laminate, and includes: a step for affixing an insulated substrate layer and a copper member having convex parts of the surface thereof to each other; a step for peeling off the copper member and thereby transferring the convex parts to the surface of the insulated substrate layer and forming a seed layer; a step for forming a resist at a prescribed location on the surface of the seed layer; a step for performing a copper plating process on a region on the surface of the seed layer on which the resist is not laminated and thereby laminating the copper; a step for removing the resist; and a step for removing the seed layer exposed due to the removal of the resist.
Inventors:
OBATA NAOKI (JP)
SATO MAKIKO (JP)
SATO MAKIKO (JP)
Application Number:
PCT/JP2022/013645
Publication Date:
September 29, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C23F1/34; C23C26/00; H05K3/18; H05K3/38
Domestic Patent References:
| WO2015040998A1 | 2015-03-26 | |||
| WO2014080959A1 | 2014-05-30 | |||
| WO2017056534A1 | 2017-04-06 | |||
| WO2019244541A1 | 2019-12-26 |
Foreign References:
| JP6806405B1 | 2021-01-06 | |||
| JP2000036660A | 2000-02-02 | |||
| JP2005223226A | 2005-08-18 | |||
| JP2010267891A | 2010-11-25 | |||
| JP2002176242A | 2002-06-21 | |||
| JP2021052381A | 2021-04-01 |
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
Download PDF: