METHOD FOR MANUFACTURING METAL FOIL CLAD LAMINATED SHEET, RESIN COMPOSITION, RESIN COMPOSITE SHEET, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2024/034276

A1

The present invention provides a method for manufacturing a metal foil clad laminated sheet having excellent mass productivity and in which peeling of a resin composition layer and a metal foil is suppressed, as well as a resin composition, a resin composite sheet, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor device. A method for manufacturing a metal foil clad laminated sheet in which a resin composite sheet C including a metal foil and a resin composition layer disposed on one side of the metal foil is laminated on the surface of a circuit board A including an insulating layer and a conductor circuit layer, using a vacuum laminating device, the method for manufacturing a metal foil clad laminated sheet comprising the following steps. Step 1: A step for obtaining a circuit board B by reducing the content of moisture and/or a solvent included in the circuit board A. Step 2: A step for obtaining a laminated board D by placing, heating, and pressurizing in a reduced pressure or vacuum environment the circuit board B and the resin composite sheet C. Step 3: A step for obtaining a laminated board E by smoothing the surface of the resin composition layer of the laminated board D.

OKUMURA KEISUKE (JP)
KOMATSU KOUKI (JP)
HASEBE KEIICHI (JP)
HIRANO SHUNSUKE (JP)

PCT/JP2023/023658

February 15, 2024

June 26, 2023

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MITSUBISHI GAS CHEMICAL CO (JP)

H05K3/46; B32B15/08; H05K1/03

JP2022039763A	2022-03-10
JPH10256726A	1998-09-25
JP2009105446A	2009-05-14

SIKS & CO. (JP)

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