Title:
METHOD FOR MANUFACTURING MIRROR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/137674
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a mirror device comprising a structure having a support part, a movable part, and a coupling part, and a mirror layer provided on the movable part. This method for manufacturing the mirror device comprises: a first forming step for forming a plurality of portions each corresponding to the structure on a wafer; a second forming step for forming the mirror layer on a section corresponding to the movable part in each of the plurality of portions; a heating step for, after the first forming step and the second forming step, heating the section corresponding to the movable part in each of the plurality of portions; and a cutting step for, after the heating step, cutting the wafer such that the plurality of portions are separated from each other.
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Inventors:
IDE TOMOYUKI (JP)
SUZUKI DAIKI (JP)
TAKAHASHI MIKITO (JP)
SUZUKI DAIKI (JP)
TAKAHASHI MIKITO (JP)
Application Number:
PCT/JP2021/033949
Publication Date:
June 30, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G02B26/08; B81C1/00; G02B26/10
Foreign References:
JP2010044410A | 2010-02-25 | |||
JP2018010038A | 2018-01-18 | |||
JP2011180249A | 2011-09-15 | |||
CN110927960A | 2020-03-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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