Title:
METHOD FOR MANUFACTURING MODULE
Document Type and Number:
WIPO Patent Application WO/2018/105348
Kind Code:
A1
Abstract:
This method for manufacturing a module is provided with: a first step for preparing a seed layer that is disposed on one surface of a first peeling layer, said one surface being in the thickness direction; a second step for forming, by means of plating using power supplied from the seed layer, a conductor pattern on one surface of the seed layer, said one surface being in the thickness direction; a third step for pressing the conductor pattern into a first adhesive layer containing first magnetic particles; and a fourth step for exposing the conductor pattern, and the other surface of the first adhesive layer, said the other surface being in the thickness direction.
Inventors:
FURUKAWA YOSHIHIRO (JP)
OKUMURA KEISUKE (JP)
OKUMURA KEISUKE (JP)
Application Number:
PCT/JP2017/041229
Publication Date:
June 14, 2018
Filing Date:
November 16, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01F41/04; H01F17/00; H05K1/16; H05K3/20
Foreign References:
| JP2004241538A | 2004-08-26 | |||
| JPH08162352A | 1996-06-21 | |||
| JP2008166407A | 2008-07-17 | |||
| JP2004327612A | 2004-11-18 | |||
| JP2016108561A | 2016-06-20 | |||
| JP2016006853A | 2016-01-14 | |||
| JP2016006852A | 2016-01-14 | |||
| JP2016006163A | 2016-01-14 |
Other References:
See also references of EP 3553801A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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