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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE, AND MULTI-PIECE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/140270
Kind Code:
A1
Abstract:
A method for manufacturing a multi-piece substrate includes: a step of forming a frame section (11b) on a manufacture panel different from a piece section (12a); a step of inspecting whether the piece section (12a) is acceptable or not and sorting the acceptable pieces; a step of forming a chipped section (132a) on the end section of the frame section (11b) and/or on the end section of the piece section (12a); step of disposing and temporarily fixing the frame section (11b) and the piece section (12a) such that the frame section and the piece section face each other with the chipped section (132a) therebetween; a step of applying an adhesive (16) to a receiving recess (132) formed by the chipped section (132a) in the temporarily fixed state; and a step of connecting the piece section (12a) to the frame section (11b) by hardening the adhesive (16) applied to the receiving recess (132).

Inventors:
YADA TAKAHIRO (JP)
Application Number:
PCT/JP2009/068622
Publication Date:
December 09, 2010
Filing Date:
October 29, 2009
Export Citation:
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Assignee:
IBIDEN CO LTD (JP)
YADA TAKAHIRO (JP)
International Classes:
H05K3/00; H05K1/02
Foreign References:
JP2007115855A2007-05-10
JP2002289986A2002-10-04
JP2000252605A2000-09-14
JP2005038953A2005-02-10
JPH10247656A1998-09-14
JPH11307905A1999-11-05
Attorney, Agent or Firm:
KIMURA MITSURU (JP)
Mitsuru Kimura (JP)
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