Title:
A METHOD OF MANUFACTURING A MUTUAL CONNECTION STRUCTURE BETWEEN MULTI-LAYER BASEBOARDS AND STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/095337
Kind Code:
A1
Abstract:
A method of manufacturing a mutual connection structure between multi-layer baseboards
includes following steps: separating at least the end of a dielectric layer and
a corresponding metal layer of each multi-layer baseboard from the end of other
dielectric layer and corresponding metal layer; and, adhering at least one of
the end of the separated dielectric layer of one multi-layer baseboard to the
separated end of a metal layer of another multi-layer baseboard so as to obtain
a mutual connection structure between the multi-layer baseboards. The mutual
connection structure includes at least a first multi-layer baseboard (300)
and a second multi-layer baseboard (400). At least one first metal layer (12,15,18)
of the first baseboard adheres to each other with a second metal layer (22 25 28)
of the second baseboard to form a connection portion between the two multi-layer
baseboards.
Inventors:
YANG CHIHKUANG (CN)
Application Number:
PCT/CN2007/000378
Publication Date:
August 14, 2008
Filing Date:
February 05, 2007
Export Citation:
Assignee:
PRINCO CORP (CN)
International Classes:
H05K3/36; H05K1/14; H01L23/12; H01L23/48; H01L23/50; H05K3/46
Foreign References:
| CN1703136A | 2005-11-30 | |||
| CN2786910Y | 2006-06-07 | |||
| CN1231965C | 2005-12-14 | |||
| CN1351815A | 2002-05-29 | |||
| CN1186971C | 2005-01-26 | |||
| CN1652663A | 2005-08-10 | |||
| CN1713802A | 2005-12-28 | |||
| CN1575094A | 2005-02-02 | |||
| JPH08236937A | 1996-09-13 | |||
| JPH05243741A | 1993-09-21 | |||
| JP2002314257A | 2002-10-25 | |||
| JPH0758431A | 1995-03-03 |
Other References:
See also references of EP 2120521A4
Attorney, Agent or Firm:
ESSEN PATENT AGENCY (SHANGHAI) (Wuning Road, Shanghai 3, CN)
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