Title:
A MUTUAL CONNECTION STRUCTURE BETWEEN MULTI-LAYER BOARDS AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2008/095338
Kind Code:
A1
Abstract:
A mutual connection structure between multi-layer baseboards and manufacturing method
thereof are provided. The structure includes a first multi-layer baseboard (300)
and a second multi-layer baseboard (400). The first multi-layer baseboard has
a first metal layer (11), a first dielectric layer (13) and a hole (1,2,3). The
end edge of the first metal layer is connected to that of the corresponding first
dielectric layer, and separated from the end edge of the other adjacent first
metal layers (14,17) and dielectric layers (16,19). The second multi-layer baseboard
has a second metal layer (21) and a second dielectric layer (23). The end edge of
the second metal layer is connected to that of the corresponding second dielectric
layer, and separated from the end edge of the other adjacent second metal layers
(24,27) and dielectric layers (26,29). The hole are formed on the end of the first
dielectric layer of the first multi-layer baseboard, and have a conductive portion
therein. The conductive portion of the first metal layer is bonded to the second
metal layer of the second multi-layer baseboard.
Inventors:
YANG CHIHKUANG (CN)
Application Number:
PCT/CN2007/000379
Publication Date:
August 14, 2008
Filing Date:
February 05, 2007
Export Citation:
Assignee:
PRINCO CORP (CN)
International Classes:
H05K1/14; H05K3/36; H01L23/12; H01L23/48; H01L23/50; H05K3/46
Foreign References:
| CN1703136A | 2005-11-30 | |||
| CN2786910Y | 2006-06-07 | |||
| CN1231965C | 2005-12-14 | |||
| CN1351815A | 2002-05-29 | |||
| CN1186971C | 2005-01-26 | |||
| CN1652663A | 2005-08-10 | |||
| CN1713802A | 2005-12-28 | |||
| CN1575094A | 2005-02-02 | |||
| JPH08236937A | 1996-09-13 | |||
| JPH05243741A | 1993-09-21 | |||
| JP2002314257A | 2002-10-25 | |||
| JPH0758431A | 1995-03-03 |
Other References:
See also references of EP 2120517A4
Attorney, Agent or Firm:
ESSEN PATENT AGENCY (SHANGHAI) (Wuning Road, Shanghai 3, CN)
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