Title:
METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR CARRYING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT-MOUNTED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/003703
Kind Code:
A1
Abstract:
A method for manufacturing a package substrate for carrying a semiconductor element, including: a substrate formation step (a) for forming a support substrate for forming a circuit, the support substrate for forming a circuit including, in the sequence listed, a peeling layer including at least a first insulating resin layer and a silicon compound and an ultrathin copper foil having a thickness of 1-5 μm; a first wiring conductor formation step (b) for forming a first wiring conductor by pattern electrolytic copper plating on the ultrathin copper foil of the support substrate for forming a circuit; a lamination step (c) for disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and applying heat and pressure to the second insulating resin layer and laminating the second insulating resin layer; a second wiring conductor formation step (d) for forming a non-penetrating hole reaching the first wiring conductor in the second insulating resin layer, connecting the inner wall of the non-penetrating hole by electrolytic copper plating and/or electroless copper plating, and forming a second wiring conductor; a peeling step (e) for peeling the first insulating resin layer from the support substrate for forming a circuit on which the first wiring conductor and the second wiring conductor are formed; and a removal step (f) for removing the release layer and/or the ultrathin copper coil.
Inventors:
HIRANO SYUNSUKE (JP)
KATO YOSHIHIRO (JP)
OGASHIWA TAKAAKI (JP)
KAWASHITA KAZUAKI (JP)
NAKAJIMA YOUICHI (JP)
KATO YOSHIHIRO (JP)
OGASHIWA TAKAAKI (JP)
KAWASHITA KAZUAKI (JP)
NAKAJIMA YOUICHI (JP)
Application Number:
PCT/JP2017/023237
Publication Date:
January 04, 2018
Filing Date:
June 23, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| WO2014054812A1 | 2014-04-10 |
Foreign References:
| JP2009032918A | 2009-02-12 | |||
| JP2005101137A | 2005-04-14 |
Other References:
See also references of EP 3480843A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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