Title:
THERMALLY CURABLE ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2018/003704
Kind Code:
A1
Abstract:
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, has satisfactory adhesive strength.
The thermally curable electroconductive adhesive according to the present invention comprises components (A) to (D): component (A), which is a urethane-modified polyfunctional (meth)acrylate oligomer that is either an aromatic-urethane-modified (meth)acrylate oligomer having six (meth)acryl groups in the molecule or an aliphatic-urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule; component (B), which is a monofunctional (meth)acrylate monomer; component (C), which is an organic peroxide; and component (D), which is electroconductive particles.
When component (A) is an aliphatic-urethane-modified (meth)acrylate oligomer having two (meth)acryl groups in the molecule, then component (B) is a monofunctional acrylate monomer.
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Inventors:
OTA SOICHI (JP)
KATO MAKOTO (JP)
MAFUNE HITOSHI (JP)
OSADA MASAYUKI (JP)
KATO MAKOTO (JP)
MAFUNE HITOSHI (JP)
OSADA MASAYUKI (JP)
Application Number:
PCT/JP2017/023244
Publication Date:
January 04, 2018
Filing Date:
June 23, 2017
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J9/02; C08F290/06; C09J4/02; C09J11/04; C09J11/06; C09J175/14; H01B1/22
Domestic Patent References:
| WO2013089061A1 | 2013-06-20 |
Foreign References:
| JP2014102943A | 2014-06-05 | |||
| JP2015154016A | 2015-08-24 | |||
| JP2017014341A | 2017-01-19 | |||
| JP2017066367A | 2017-04-06 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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