Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2021/171336
Kind Code:
A1
Abstract:
This method for manufacturing a semiconductor module includes: preparing a mounting sheet 11 that is a flexible insulating sheet 10 having an adhesive 12 applied thereto; forming first via holes 16a passing through the mounting sheet at portions of the mounting sheet, said portions corresponding to current electrodes 21a, 21b used for at least one of current outflow from and current inflow into a semiconductor chip 20 scheduled to be mounted; bonding the semiconductor chip to the mounting sheet by means of the adhesive so that the first via holes and the current electrodes overlap and then curing the adhesive; forming, after curing the adhesive, a second via hole 16b that passes through the mounting sheet so as to correspond to a control electrode 21c of the semiconductor chip and that has a smaller size than the first via holes; and forming a metal layer electrically connected to the current electrodes and the control electrode through the first via holes and the second via hole.
Inventors:
KAWASHIMA TASUKU (JP)
Application Number:
PCT/JP2020/007337
Publication Date:
September 02, 2021
Filing Date:
February 25, 2020
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01L23/12
Foreign References:
| JP2016046523A | 2016-04-04 | |||
| JP2016192557A | 2016-11-10 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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