Title:
METHOD FOR MANUFACTURING STRUCTURAL BODY AND METHOD FOR MANUFACTURING JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2021/033466
Kind Code:
A1
Abstract:
Provided are: a method for manufacturing a structural body with which it is possible to easily achieve highly reliable joining with an object to be joined; and a method for manufacturing a joined body using the joined body. This method for manufacturing a structural body has: a preparation step for preparing a conductive substrate that has a conductive surface having conductivity, and a mold member that has a to-be-filled portion formed from a plurality of recessed portions or a plurality of through-holes; an application step for bringing the to-be-filled portion of the mold member into contact with at least the conductive surface; and a removal step for removing the mold member. Said method has, between the preparation step and the removal step, a first filling step for filling the to-be-filled portion with a conductive substance, or a second filling step for filling the to-be-filled portion with a processing solution for dissolving the conductive substrate. A plurality of protruding portions having conductivity are formed on the conductive surface by removing the mold member in the removal step.
Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2020/027638
Publication Date:
February 25, 2021
Filing Date:
July 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; H01L21/60
Domestic Patent References:
| WO2017094874A1 | 2017-06-08 |
Foreign References:
| JP2009132974A | 2009-06-18 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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