Title:
METHOD FOR PRODUCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/033467
Kind Code:
A1
Abstract:
Provided is a method for producing a structure that can be easily bonded to a bonding target. The method for producing a structure comprises: a conductive layer forming step for forming a conductive layer having conductivity on a portion of the surface of an insulating support body having at least one surface; a valve metal layer forming step for forming a valve metal layer that covers at least a part of the conductive layer; an anodized film forming step for performing anodization using the conductive layer as an electrode, and forming, into an anodized film, a valve metal layer portion, disposed in a region on the conductive layer, of the valve metal layer; a micropore forming step for forming, on the anodized film, a plurality of micropores extending in the thickness direction; and a filling step for filling the micropores with conductive materials, wherein the method further comprises, between the anodized film forming step and the filling step, a valve metal layer removal step for removing the valve metal layer after the anodized film forming step.
Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2020/027662
Publication Date:
February 25, 2021
Filing Date:
July 16, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C28/00; C25D11/04; C25D11/20; C25D11/24; H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2018159186A1 | 2018-09-07 | |||
| WO2019039071A1 | 2019-02-28 | |||
| WO2015029881A1 | 2015-03-05 |
Foreign References:
| JP2001143600A | 2001-05-25 | |||
| JP2006326724A | 2006-12-07 | |||
| JP2004014406A | 2004-01-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
Download PDF:
Previous Patent: METHOD FOR MANUFACTURING STRUCTURAL BODY AND METHOD FOR MANUFACTURING JOINED BODY
Next Patent: GLASS-PLATE PACKING BODY
Next Patent: GLASS-PLATE PACKING BODY