Title:
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD ASSEMBLY SHEET
Document Type and Number:
WIPO Patent Application WO/2022/244305
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a wiring circuit board assembly sheet (1), the method including: a marking step for forming, in a metal support substrate (2), a mark (C) including a recessed portion (9); and an insulating layer forming step for forming, after the marking step, a base insulating layer (3) on one surface of the metal support substrate (2) in a thickness direction, the metal support substrate (2) being provided with the mark (C).
Inventors:
TAMAKI YUSAKU (JP)
FUKUSHIMA RIHITO (JP)
NIINO TEPPEI (JP)
FUKUSHIMA RIHITO (JP)
NIINO TEPPEI (JP)
Application Number:
PCT/JP2022/002118
Publication Date:
November 24, 2022
Filing Date:
January 21, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| JP2011171658A | 2011-09-01 | |||
| JP2011124491A | 2011-06-23 | |||
| JP2010161302A | 2010-07-22 | |||
| JP2013201221A | 2013-10-03 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Download PDF: