Title:
METHOD FOR MOLDING SEMICONDUCTOR PACKAGE, AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/204266
Kind Code:
A1
Abstract:
Disclosed are a method for molding a semiconductor package, and an apparatus therefor, according to the present invention. The apparatus for molding a semiconductor package is an apparatus for molding a semiconductor package which places a wire-bonded chip in a cavity formed by a drag and a cope, and injects a molding compound for filling, wherein the drag is formed so as to have a convex curvature on the bottom surface of the cavity of the drag. According to the present invention, the drag is formed so as to have a convex curvature at the bottom of the cavity of the drag in consideration of the shrinkage rate of the compound when molding the semiconductor package, such that a defect does not occur on the bottom surface of the semiconductor package during solidification of the molding compound.
Inventors:
PARK OH HEE (KR)
Application Number:
PCT/KR2019/007866
Publication Date:
October 08, 2020
Filing Date:
June 28, 2019
Export Citation:
Assignee:
PARK OH HEE (KR)
International Classes:
H01L21/67; B29C39/10; B29C39/26; B29C39/38; H01L21/56; H01L23/31
Foreign References:
| JP2003158143A | 2003-05-30 | |||
| KR20170092323A | 2017-08-11 | |||
| KR20030050304A | 2003-06-25 | |||
| JP2010098129A | 2010-04-30 | |||
| KR20150078319A | 2015-07-08 |
Attorney, Agent or Firm:
CHEON JEE INTERNATIONAL PATENT & LAW (KR)
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