METHOD FOR MOLDING THERMOPLASTIC RESIN PRODUCT AND MOLDING APPARATUS THEREFOR

WIPO Patent Application WO/2013/008410

A1

The objective of the present invention is to provide a method for molding a thermoplastic resin product and a molding apparatus therefor, whereby productivity and quality can be enhanced. A molding apparatus (1) comprises: a heating device (2); a stamper (3); a cooling member (4); a first die (5) having a structure for movably retaining the stamper (3) and for making it possible to bring into contact or separate the stamper (3) and the cooling member (4); and a second die (6); and adopts a configuration in which the stamper (3) is radiatingly heated at least when separated from the cooling member (4).

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AOYA MASAKI (JP)
KIMURA SATOO (JP)
IWASAKI TSUTOMU (JP)

PCT/JP2012/004299

January 17, 2013

July 03, 2012

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TOYO SEIKAN KAISHA LTD (JP)
AOYA MASAKI (JP)
KIMURA SATOO (JP)
IWASAKI TSUTOMU (JP)

B29C59/02; B29C33/06; H05B3/00

JP2005074700A	2005-03-24
JP2006137019A	2006-06-01
JP2011061214A	2011-03-24
JP2006088517A	2006-04-06
JP2006231588A	2006-09-07
JP2008288673A	2008-11-27
JP2012091456A	2012-05-17
JP2001158044A	2001-06-12
JP2006255900A	2006-09-28
JP2002513315A	2002-05-08
JP2006216237A	2006-08-17
JP4363727B2	2009-11-11
JP2011151395A	2011-08-04

See also references of EP 2730392A4

WATANABE, Kihei et al. (JP)
Kihei Watanabe (JP)

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