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Title:
METHOD FOR PRODUCING CURED SEALANT
Document Type and Number:
WIPO Patent Application WO/2019/235217
Kind Code:
A1
Abstract:
This method for producing a cured sealant by using an adhesive sheet having: a base material (Y) equipped with a non-expandable base material layer (Y2) and an expandable base material layer (Y1) that contains expandable particles; and a first adhesive layer (X1) and a second adhesive layer (X2). The method comprises steps (1)-(3). Step (1): A step for attaching the adhesive surface of the first adhesive layer (X1) to a hard support body, and placing an object to be sealed on a portion of the adhesive surface of the second adhesive layer (X2). Step (2): A step for covering the object to be sealed and the adhesive surface of the second adhesive layer (X2) with a sealant, and then letting said sealant to cure so as to obtain a cured sealant. Step (3): A step for causing the expandable particles to expand so as to separate the hard support body and the first adhesive layer (X1) from each other at an interface P therebetween.

Inventors:
YAMADA TADATOMO (JP)
TAKYU SHINYA (JP)
Application Number:
PCT/JP2019/020190
Publication Date:
December 12, 2019
Filing Date:
May 22, 2019
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/56; C09J7/20; C09J7/38; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2013011850A12013-01-24
Foreign References:
JP2003064329A2003-03-05
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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