Title:
METHOD FOR PRODUCING DIE, AND DIE
Document Type and Number:
WIPO Patent Application WO/2011/055757
Kind Code:
A1
Abstract:
Disclosed is a method for producing a die, which comprises: a step of preparing an aluminum base or aluminum film (18); a step of forming a first recessed portion (18h), which has a two dimensional size of 200 nm or more but 100 μm or less when viewed in the direction of the normal line of the surface of the aluminum film (18), by passing an electric current between the surface that serves as a cathode and a counter electrode in an aqueous solution; a subsequent step of forming a porous alumina layer (10A) between the internal surface of the first recessed portion (18h) and the first recessed portion (18h) by anodizing the surface, said porous alumina layer (10A) having a second recessed portion (12) that has a two dimensional size of 10 nm or more but less than 500 nm; and a subsequent step of enlarging the second recessed portion (12) of the porous alumina layer (10A) by bringing the porous alumina layer (10A) into contact with an etching liquid. By this method, a die having a macro recessed and projected structure that performs an antiglare function can be efficiently produced.
Inventors:
IHARA ICHIROH
Application Number:
PCT/JP2010/069625
Publication Date:
May 12, 2011
Filing Date:
November 04, 2010
Export Citation:
Assignee:
SHARP KK (JP)
IHARA ICHIROH
IHARA ICHIROH
International Classes:
C25D11/16; B29C33/38; B29C33/42; C25D11/00; C25D11/24; G02B1/11
Domestic Patent References:
| WO2009054513A1 | 2009-04-30 |
Foreign References:
| JP2008197217A | 2008-08-28 | |||
| JPH02240292A | 1990-09-25 |
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
Seiji Okuda (JP)
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