Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/250129
Kind Code:
A1
Abstract:
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to a circuit formation surface side of an electronic component; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. The adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. With respect to the step (C), the loss tangent tanδ at -5°C of the adhesive resin layer of the adhesive film after irradiation of ultraviolet light is from 0.25 to 0.85 as determined under the conditions described below.
(Conditions: The dynamic viscoelasticity is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°.)
More Like This:
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/021678
Publication Date:
December 01, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L21/301; C09J7/38
Domestic Patent References:
| WO2019189069A1 | 2019-10-03 |
Foreign References:
| JP2016121231A | 2016-07-07 | |||
| JP2020098861A | 2020-06-25 | |||
| JP2019161031A | 2019-09-19 | |||
| JPS60196956A | 1985-10-05 | |||
| JP2014075560A | 2014-04-24 | |||
| JP2016072546A | 2016-05-09 | |||
| JP2021090244A | 2021-06-10 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: