BACK GRINDING ADHESIVE FILM AND METHOD FOR PRODUCING ELECTRONIC DEVICE

WIPO Patent Application WO/2022/250128

A1

Provided is a back grinding adhesive film that is used to protect the surface of a wafer. This adhesive film includes a substrate layer and an adhesive resin layer provided on one side of the substrate layer and composed of a UV-curable adhesive resin material. The UV-curable adhesive resin material satisfies property (A) below, when the viscoelastic properties thereof are measured by following steps (i) and (ii) below. [Step] (i) A film having a thickness of 0.2 mm is formed by using a UV-curable adhesive resin material. The film is irradiated with ultraviolet rays having a dominant wavelength of 365 nm by using a high-pressure mercury lamp, under an environment of 25℃, with an irradiation intensity of 100 W/cm2 and an ultraviolet level of 1080 mJ/cm2, so that the film is cured by the ultraviolet rays to obtain a cured film.　(ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz, in a tensile mode, and in a temperature range of -50 to 200℃. [Property] (A) The loss tangent tan δ at -5℃ is 0.25-0.85.

YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)

PCT/JP2022/021677

December 01, 2022

May 27, 2022

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MITSUI CHEMICALS TOHCELLO INC (JP)

B32B27/00; C09J7/38; H01L21/301; H01L21/304

WO2019189069A1

2019-10-03

JP2016121231A	2016-07-07
JP2020098861A	2020-06-25
JP2019161031A	2019-09-19
JP2014075560A	2014-04-24
JP2016072546A	2016-05-09
JP2021090275A	2021-06-10

HAYAMI Shinji (JP)

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