Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/250136
Kind Code:
A1
Abstract:
This method for producing an electronic device at least includes: a step (A) for preparing a structure comprising a wafer which has a circuit-forming surface and an adhesive film stuck on the circuit-forming surface side of the wafer; a step (B) for backgrinding the surface on the side opposite to the circuit-forming surface side of the wafer; and a step (C) for irradiating the adhesive film with UV light and thereafter removing the adhesive film from the wafer. The adhesive film comprises: a base layer; and an adhesive resin layer which is provided on one side of the base layer and which is composed of a UV-curable adhesive resin material. In step (C), E'(100°C), which is the storage elastic modulus at 100°C of the adhesive resin layer of the adhesive film after being irradiated with UV light, is 1.0 × 106 to 3.5 × 107 Pa when measured under the condition shown below, and E'(100°C)/E'(-15°C) is 2.0 × 10-3 to 1.5 × 10-2. (Condition) The dynamic viscoelasticity is measured in tensile mode at a frequency of 1 Hz and in the temperature range from -50°C to 200°C.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/021702
Publication Date:
December 01, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J133/00; C09J7/38; H01L21/301
Domestic Patent References:
| WO2020246207A1 | 2020-12-10 |
Foreign References:
| JP2019016633A | 2019-01-31 | |||
| JP2018195746A | 2018-12-06 | |||
| JP2021005623A | 2021-01-14 | |||
| JP2014075560A | 2014-04-24 | |||
| JP2016072546A | 2016-05-09 | |||
| JP2021090312A | 2021-06-10 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: