Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/250137
Kind Code:
A1
Abstract:
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formation surface side of the wafer; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. Meanwhile, the adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. The loss tangent tanδ at -5°C of a cured film of the ultraviolet curable adhesive resin material as determined by the procedure described below is from 0.25 to 0.85. [Procedure]:
(i) A film having a film thickness of 0.2 mm is formed with use of an ultraviolet curable adhesive resin material; and the film is irradiated with ultraviolet light having a main wavelength of 365 nm at an irradiation intensity of 100 W/cm2 at an ultraviolet dose of 1,080 mJ/cm2 with use of a high pressure mercury lamp in an environment of 25°C, thereby obtaining a cured film by means of ultraviolet curing. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°C.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/021703
Publication Date:
December 01, 2022
Filing Date:
May 27, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L21/301; C09J7/38
Domestic Patent References:
| WO2019189069A1 | 2019-10-03 |
Foreign References:
| JP2016121231A | 2016-07-07 | |||
| JP2020098861A | 2020-06-25 | |||
| JP2019161031A | 2019-09-19 | |||
| JP2007045965A | 2007-02-22 | |||
| JP2014075560A | 2014-04-24 | |||
| JP2016072546A | 2016-05-09 | |||
| JP2021090503A | 2021-06-17 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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