Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR PRODUCING INJECTION-MOLDED ARTICLE AND ELECTRONIC DEVICE COMPRISING INJECTION-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/220485
Kind Code:
A1
Abstract:
A method for producing an injection-molded article, according to various embodiments disclosed in the present document, comprises the operations of: molding an injection-molded article; irradiating a laser on regions spaced from each other (primary irradiation regions hereinafter), on at least a portion of the surface of the injection-molded article (primary irradiation operation hereinafter); irradiating a laser on other regions spaced from each other (secondary irradiation regions hereinafter), on at least a portion of the surface of the injection-molded article (secondary irradiation operation hereinafter); and, on the surface of the injection-molded article, forming a plating layer on the primary irradiation regions and the secondary irradiation regions, wherein each of the secondary irradiation regions may at least partially overlap with at least one of the primary irradiation regions. Other various embodiments are possible.

Inventors:
JUNG CHUNGHYO (KR)
PARK SEONMI (KR)
PARK HYEIN (KR)
Application Number:
PCT/KR2022/005018
Publication Date:
October 20, 2022
Filing Date:
April 07, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B29C45/00; B23K26/362; C23C14/00; C23C14/06; G06Q50/04; B29L31/34
Foreign References:
KR20140106862A2014-09-04
KR20120108752A2012-10-05
KR100882114B12009-02-06
KR101968047B12019-04-10
KR101535655B12015-07-13
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: