Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDED ARTICLE FOR SEMICONDUCTOR DEVICE TEST SOCKET COMPRISING POLYIMIDE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/220484
Kind Code:
A1
Abstract:
The present invention relates to a molded article for a semiconductor device test socket comprising a polyimide resin and a method for manufacturing same, characterized in that excellent mechanical properties, surface resistance stability against high-density energy, and heat resistance are realized through combination of monomers and optimization of a polymerization process without comprising a filler.

More Like This:
JP2623713[Title of the Invention] A method for producing a polysulfone-modified cyanato resin.
JPS62263253RESIN COMPOSITION
WO/2023/032784LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT
Inventors:
KIM JIN MO (KR)
KIM SANG HYUN (KR)
Application Number:
PCT/KR2022/005016
Publication Date:
October 20, 2022
Filing Date:
April 07, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAELIM CO LTD (KR)
International Classes:
C08L79/08; C08G73/10; G01R1/04; G01R3/00
Foreign References:
KR20190008538A2019-01-24
KR20150070954A2015-06-25
KR101912737B12018-10-30
JP2005068227A2005-03-17
EP1236756A12002-09-04
Attorney, Agent or Firm:
HALLA PATENT & LAW FIRM (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: HEAT SUPPLY AND ELECTRICITY GENERATION DEVICE USING ULTRA-CONDENSING DOUBLE-SIDED HEAT-COLLECTING DE...

Next Patent: METHOD FOR PRODUCING INJECTION-MOLDED ARTICLE AND ELECTRONIC DEVICE COMPRISING INJECTION-MOLDED ARTI...