Title:
METHOD FOR PRODUCING MULTILAYER BODY, MULTILAYER BODY AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/030392
Kind Code:
A1
Abstract:
The present invention relates to a method for producing a multilayer body, said method comprising: a step for forming a multilayer body precursor which comprises two glass substrates and a thermosetting resin layer that is arranged between the two glass substrates; and a step for obtaining a multilayer body with a warp, said multilayer body comprising the two glass substrates and a resin layer that is arranged between the two glass substrates, by forming the resin layer by thermally curing the thermosetting resin layer, while maintaining the multilayer body precursor in a deformed state.
Inventors:
YAMADA KAZUO (JP)
Application Number:
PCT/JP2021/028381
Publication Date:
February 10, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B17/10; C03C27/10; H01L21/56; H01L23/12; H05K1/03; H05K1/18
Domestic Patent References:
| WO2011155403A1 | 2011-12-15 | |||
| WO2016088868A1 | 2016-06-09 | |||
| WO2019172313A1 | 2019-09-12 | |||
| WO2020129297A1 | 2020-06-25 | |||
| WO2017018275A1 | 2017-02-02 | |||
| WO2018051987A1 | 2018-03-22 |
Foreign References:
| US4969966A | 1990-11-13 | |||
| JPH0826788A | 1996-01-30 | |||
| JPH0578153A | 1993-03-30 | |||
| JP2016175835A | 2016-10-06 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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