Title:
METHOD FOR PRODUCING PLATED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/132171
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a method for producing a plated component, the method having fewer restrictions on resin materials to be plated, while being capable of increasing the contrast of plating deposition. [Solution] In a method for producing a plated component according to the present technology, a first substance is embedded in a target region in the surface of a resin base material; after the embedment of the first substance, a plating catalyst solution containing a second substance that adsorbs to the first substance is supplied to the surface, thereby loading the target region with the second substance; after the supply of the plating catalyst solution, a plating solution containing a third substance that deposits using the second substance as a catalyst is supplied to the surface, thereby forming a plating layer, which is formed of the third substance, on the target region.
Inventors:
SAKURAGI YUKI (JP)
Application Number:
PCT/JP2022/044808
Publication Date:
July 13, 2023
Filing Date:
December 06, 2022
Export Citation:
Assignee:
SONY GROUP CORP (JP)
International Classes:
C23C18/20
Domestic Patent References:
| WO2004108986A1 | 2004-12-16 |
Foreign References:
| JP2017226890A | 2017-12-28 | |||
| JP2017106063A | 2017-06-15 | |||
| US20210262094A1 | 2021-08-26 | |||
| JP2005260171A | 2005-09-22 | |||
| JPH04289177A | 1992-10-14 |
Attorney, Agent or Firm:
MINAMI AOYAMA PATENT AND TRADEMARK ATTORNEYS (JP)
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