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Title:
METHOD FOR PRODUCING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/167000
Kind Code:
A1
Abstract:
A method for producing a polyimide film formed of a polyimide resin that has a constitutional unit A derived from a tetracarboxylic dianhydride and a constitutional unit B derived from a diamine, the constitutional unit A including a constitutional unit derived from an alicyclic tetracarboxylic dianhydride, the constitutional unit B including a constitutional unit (B1) derived from a compound represented by general formula (b1), the method comprising: applying on a support a polyimide varnish obtained by dissolving said polyimide resin in an organic solvent; removing the organic solvent at 60-140°C to obtain a self-supporting film; detaching the self-supporting film from the support; fixing an end of the self-supporting film; and baking the film at a temperature that is higher than the glass transition temperature of the polyimide resin and that is at most 50°C higher than the glass transition temperature of the polyimide resin. (In formula (b1), X1 represents a single bond, an alkylene group optionally substituted with fluorine and having 1-5 carbon atoms, an alkylidene group optionally substituted with fluorine and having 2-5 carbon atoms, -S-, -SO-, -SO2-, -O-, or -CO-.)

Inventors:
NAKANISHI KOHEI (JP)
SUENAGA SHUYA (JP)
HIROSE SHIGEYUKI (JP)
Application Number:
PCT/JP2021/006115
Publication Date:
August 26, 2021
Filing Date:
February 18, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2016158825A12016-10-06
WO2019163830A12019-08-29
Foreign References:
JP2018203906A2018-12-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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