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Title:
METHOD FOR PRODUCING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2024/058194
Kind Code:
A1
Abstract:
This method for producing a polyimide film comprises: a step 1 in which, at 50°C to 120°C, a solvent is removed from a varnish that contains the solvent and a polyimide precursor having a polyamic acid moiety, and the resulting varnish is dried; and a step 2 in which the resulting product is imidized by being held at 300°C to 400°C for 10 minutes to 120 minutes, and subsequently held at 420°C to 500°C. With respect to this method for producing a polyimide film, the polyamic acid moiety has a structural unit that is derived from a tetracarboxylic acid dianhydride and a structural unit that is derived from a diamine; and a diamine which enables the achievement of the structural unit derived from a diamine includes a diamine that has an ionization potential of 7.10 eV or more.

Inventors:
HOSHINO SHUN (JP)
MURAYA TAKAHIRO (JP)
SUZUKI KOUJI (JP)
ISHII KENTARO (JP)
HATAKEYAMA TAKURO (JP)
Application Number:
PCT/JP2023/033284
Publication Date:
March 21, 2024
Filing Date:
September 13, 2023
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
WO2019188265A12019-10-03
WO2022054850A12022-03-17
WO2016024457A12016-02-18
Foreign References:
JP2021187934A2021-12-13
JP2020172652A2020-10-22
JP2022061487A2022-04-18
JPH10301281A1998-11-13
JP2019502786A2019-01-31
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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