Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM
Document Type and Number:
WIPO Patent Application WO/2022/255322
Kind Code:
A1
Abstract:
Disclosed is a dicing-die bonding integrated film. This dicing-die bonding integrated film comprises a dicing film that includes a base material layer and a pressure-sensitive adhesive layer composed of a UV-curable pressure-sensitive adhesive provided on the base material layer, and an adhesive layer provided on the pressure-sensitive adhesive layer of the dicing film. The adhesive force of the pressure-sensitive adhesive layer with respect to the adhesive layer, as measured at 23°C at a peel angle of 30° and a peel speed of 600 mm/min, is 15 N/25 mm or greater.
Inventors:
SUGAWARA TAKEHIRO (JP)
KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
Application Number:
PCT/JP2022/022012
Publication Date:
December 08, 2022
Filing Date:
May 30, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020136901A1 | 2020-07-02 | |||
| WO2021095302A1 | 2021-05-20 | |||
| WO2014061629A1 | 2014-04-24 | |||
| WO2020137836A1 | 2020-07-02 |
Foreign References:
| JP2021031594A | 2021-03-01 | |||
| JP2019067996A | 2019-04-25 | |||
| JP2018107386A | 2018-07-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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