INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/255321

A1

Disclosed is an integrated dicing/die bonding film which comprises a base layer, one or more pressure-sensitive adhesive layers including an ultraviolet-curable pressure-sensitive adhesive layer comprising an ultraviolet-curable pressure-sensitive adhesive, and an adhesive layer in this order. The ultraviolet-curable pressure-sensitive adhesive layer included in the pressure-sensitive adhesive layers is in contact with the adhesive layer. The ultraviolet-curable pressure-sensitive adhesive comprises a (meth)acrylic resin having a functional group capable of undergoing chain polymerization and photopolymerization initiators. The ultraviolet-curable pressure-sensitive adhesive contains at least a first photopolymerization initiator and a second photopolymerization initiator, which differs from the first photopolymerization initiator in maximum-absorption wavelength in the ultraviolet region, as the photopolymerization initiators. The content of the photopolymerization initiators is 1.5 parts by mass or higher per 100 parts by mass of the whole (meth)acrylic resin.

KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
SUGAWARA TAKEHIRO (JP)
TAKAHASHI YOSHIMASA (JP)

PCT/JP2022/022011

December 08, 2022

May 30, 2022

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SHOWA DENKO MATERIALS CO LTD (JP)

C09J201/00; C09J7/38; H01L21/301; H01L21/52

WO2011111166A1

2011-09-15

JP2020149985A	2020-09-17
JP2010209243A	2010-09-24
JP2019067996A	2019-04-25

ANONYMOUS: "IGM RESINS B.V. Photopolymerization additive, Additive.com", IGM RESINS B.V. PHOTOPOLYMERIZATION ADDITIVE, ADDITIVE.COM, XP009541721, Retrieved from the Internet

HASEGAWA Yoshiki et al. (JP)

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