Title:
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112427
Kind Code:
A1
Abstract:
The present invention provides a method for producing a semiconductor device, the method using an adhesive sheet that is capable of accurately following and adhering to recesses and projections in the surface during a processing step of a semiconductor device that has recesses and projections in the surface, such as a semiconductor chip with a bump and a PCB with a bump, while being free from the generation of an outgas during a high temperature treatment or an adhesive residue on the surface of an adherend from which the adhesive sheet is removed. A method for producing a semiconductor device according to the present invention comprises: a protection step in which an adhesive sheet that has a sheet-like base material and an adhesive layer that is formed on the base material is bonded to an adherend surface of a semiconductor device, the adherend surface having a bump; a UV irradiation step in which the adhesive sheet is irradiated with UV light, thereby curing the adhesive layer; and a separation step in which the adhesive sheet is separated and removed from the adherend surface having a bump. With respect to this method for producing a semiconductor device, the adhesive layer is a cured product of an adhesive composition; the adhesive composition contains a resin (A) that is represented by general formula (1-1) and a photopolymerization initiator (B); and the resin (A) has a weight average molecular weight of 50,000 to 550,000.
Inventors:
NAODA KOJI (JP)
NAKANISHI KENICHI (JP)
SASAKI KAZUHIRO (JP)
YUMOTO KEITA (JP)
NAKANISHI KENICHI (JP)
SASAKI KAZUHIRO (JP)
YUMOTO KEITA (JP)
Application Number:
PCT/JP2022/036826
Publication Date:
June 22, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/301; C09J7/38; C09J11/06; C09J133/14; H01L21/683
Domestic Patent References:
| WO2020049829A1 | 2020-03-12 | |||
| WO2020217793A1 | 2020-10-29 |
Foreign References:
| JP2020094199A | 2020-06-18 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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