Title:
METHOD FOR RECYCLING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/162107
Kind Code:
A1
Abstract:
A substrate recycling method according to the present disclosure is intended for recycling a substrate. The substrate recycling method includes preparing a substrate used for growing a semiconductor device layer, the substrate having a thickness; if the thickness is greater than a first value, subjecting the substrate to a polishing process in which a surface of the substrate is polished until the surface fulfills a first predetermined surface condition for forming the semiconductor device layer thereon; and if the thickness is equal to or less than the first value, subjecting the substrate to a reclamation process which increases a thickness of the substrate equal to or greater than the first value, and after the reclamation process, subjecting the substrate to the polishing process.
Inventors:
KAMIKAWA TAKESHI (JP)
Application Number:
PCT/JP2021/005313
Publication Date:
August 19, 2021
Filing Date:
February 12, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/02
Foreign References:
| US20060099776A1 | 2006-05-11 | |||
| US20110266655A1 | 2011-11-03 | |||
| JP2006332681A | 2006-12-07 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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