Title:
METHOD FOR REFLOW SOLDERING
Document Type and Number:
WIPO Patent Application WO2005101932
Kind Code:
B1
Abstract:
The invention relates to a method and device for reflow soldering strip conductors to components and to modules (4), which are attached to a printed circuit board (1) by means of a soldering paste. According to the invention, an absorption material is heated by radiating an electromagnetic wave during which the material absorbs this radiation, and this heating is transferred to the soldering paste for melting a solder contained in the soldering paste. The soldering paste is mixed with the absorption material to form a mixed material (3), and the mixed material is applied to the soldering points of the strip conductors (2).
Inventors:
LETTNER HORST (DE)
DIEHM ROLF (DE)
DIEHM ROLF (DE)
Application Number:
PCT/EP2005/003611
Publication Date:
January 19, 2006
Filing Date:
April 06, 2005
Export Citation:
Assignee:
SEHO SYSTEMTECHNIK GMBH (DE)
LETTNER HORST (DE)
DIEHM ROLF (DE)
LETTNER HORST (DE)
DIEHM ROLF (DE)
International Classes:
B23K1/005; H05K3/34; (IPC1-7): H05K3/34
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