Title:
METHOD FOR SURFACE-TREATING AND PACKAGING IMPLANT AND SYSTEM THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/191507
Kind Code:
A1
Abstract:
The present invention relates to a method for surface-treating and packaging an implant and a system therefor and, more specifically, to a method for surface-treating and packaging an implant and a system therefor, the method comprising: a packaging step of wrapping the outside of an implant with an implant package; a surface treatment step of modifying the surface of the implant in a packaged state to be hydrophilic; a gas treatment step of treating a gas inside the implant package to improve the stability of the packaged implant; and a sealing step of sealing the implant package, wherein, by modifying the surface of the implant in a packaged state to be hydrophilic, bone and/or surrounding tissues easily adhere to the implant, thus shortening the bone fusion period, resulting in improved initial stability of the implant, and, after the surface treatment of the implant, the implant is not exposed to the air and is blocked from the external air, thus preventing biological aging that may occur due to exposure to the air.
Inventors:
KIM JUNG-SUNG (KR)
SHIN TAE-JIN (KR)
KIM YONG-HWA (KR)
SHIN TAE-JIN (KR)
KIM YONG-HWA (KR)
Application Number:
PCT/KR2022/003042
Publication Date:
September 15, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
CORENTEC CO LTD (KR)
International Classes:
A61F2/30; A61C8/00; A61C8/02; A61C13/02; A61F2/00; A61L27/06
Foreign References:
| JP6807601B2 | 2021-01-06 | |||
| JP5455030B2 | 2014-03-26 | |||
| KR102169548B1 | 2020-10-23 | |||
| JP2017503572A | 2017-02-02 | |||
| KR20130028508A | 2013-03-19 |
Attorney, Agent or Firm:
KIM, Hyun-Soo (KR)
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