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Title:
PACKAGED IMPLANT SURFACE MODIFICATION METHOD USING PLASMA, AND PACKAGED IMPLANT SURFACE MODIFICATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/191506
Kind Code:
A1
Abstract:
The present invention relates to a packaged implant surface modification method using plasma, and a packaged implant surface modification system, and, more specifically, to a packaged implant surface modification method using plasma, and a packaged implant surface modification system, the method comprising: an implant provision step of providing an implant-packaging body in plasma discharge equipment, which has a chamber therein and can discharge plasma in the chamber; an air-pressure-lowering step of discharging air from the chamber through an air vent part connected to the chamber; a current application step of applying current to the plasma discharge equipment to generate plasma; and a modification step in which the discharged plasma modifies the surface of an implant so that the surface has a hydrophilic property, wherein the implant-packaging body includes at least one implant, and the implant is connected to the plasma discharge equipment to allow current to flow therebetween so that the surface thereof is modified, and thus bones and/or adjacent tissue are easily stuck to the implant to shorten a synostosis period so that the initial stability of the implant is improved and, simultaneously, the implant can be prevented from being exposed to air and becoming polluted during surface modification of the implant.

Inventors:
KIM JUNG-SUNG (KR)
SHIN TAE-JIN (KR)
KIM YONG-HWA (KR)
Application Number:
PCT/KR2022/003041
Publication Date:
September 15, 2022
Filing Date:
March 03, 2022
Export Citation:
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Assignee:
CORENTEC CO LTD (KR)
International Classes:
A61F2/30; A61C8/00; A61C8/02; A61C13/02; A61F2/00; A61L27/06
Foreign References:
KR101305382B12013-09-06
KR102169548B12020-10-23
KR101343817B12013-12-20
KR20110071111A2011-06-28
KR20120005104A2012-01-16
Attorney, Agent or Firm:
KIM, Hyun-Soo (KR)
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