Title:
MICRO-ELECTROMECHANICAL SYSTEM MICROPHONE, MICROPHONE BODY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/005952
Kind Code:
A1
Abstract:
The present disclosure discloses a micro-electromechanical system microphone, a microphone body, and an electronic device. The micro-electromechanical system microphone comprises: a substrate; a back electret which comprises a support structure; and a diaphragm located between the substrate and the back electret, wherein the support structure comprises a support portion and a support electrode, the support portion is used to support the edge of the diaphragm, and the support electrode is insulated from the supported diaphragm; in a state where bias is not applied, the diaphragm is a stress-free membrane, and in a state where a bias is applied, the support electrode clamps the edge of the diaphragm to the support portion by means of electrostatic action so as to form a fixed support for the diaphragm.
Inventors:
ZOU QUANBO (CN)
QIU GUANXUN (CN)
WANG ZHE (CN)
SONG QINGLIN (CN)
QIU GUANXUN (CN)
WANG ZHE (CN)
SONG QINGLIN (CN)
Application Number:
PCT/CN2022/108092
Publication Date:
February 02, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
GOERTEK MICROELECTRONICS INC (CN)
International Classes:
H04R19/04; B81B7/02; H04R19/00
Domestic Patent References:
| WO2013005486A1 | 2013-01-10 |
Foreign References:
| CN113613151A | 2021-11-05 | |||
| CN107809717A | 2018-03-16 | |||
| CN206341349U | 2017-07-18 | |||
| CN104602172A | 2015-05-06 | |||
| CN111885473A | 2020-11-03 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
Download PDF: