MICRO PATTERN FORMING MATERIAL, METHOD OF FORMING MICRO RESIST PATTERN AND ELECTRONIC DEVICE

Title:

MICRO PATTERN FORMING MATERIAL, METHOD OF FORMING MICRO RESIST PATTERN AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2006/022246

Kind Code:

A1

Abstract:

A micro pattern forming material comprising a water soluble resin of polyvinyl alcohol derivative, etc., a water soluble crosslinking agent of melamine derivative, urea derivative, etc., an amine compound, a nonionic surfactant and water or a solution of a mixture of water and water soluble organic solvent, the solution exhibiting a pH value of >7. This micro pattern forming material is applied onto resist pattern (3) to thereby form coating layer (4), and the coating layer (4) is heated and developed to thereby form crosslinked coating layer (5). The thickness of the crosslinked coating layer is increased by the use of a secondary amine compound and/or tertiary amine compound over that realized when no amine is added, while the thickness of the crosslinked coating layer is decreased by the use of a quaternary amine.

Inventors:

ISHIBASHI TAKEO (JP)
TAKAHASHI KIYOHISA (JP)
TAKANO YUSUKE (JP)

Application Number:

PCT/JP2005/015249

Publication Date:

March 02, 2006

Filing Date:

August 23, 2005

Export Citation:

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Assignee:

RENESAS TECH CORP (JP)
AZ ELECTRONIC MATERIALS JAPAN (JP)
ISHIBASHI TAKEO (JP)
TAKAHASHI KIYOHISA (JP)
TAKANO YUSUKE (JP)

International Classes:

G03F7/40; H01L21/027; (IPC1-7): G03F7/40; H01L21/027

Foreign References:

JP2004077951A	2004-03-11
JP2004061668A	2004-02-26
JP2001019860A	2001-01-23
JP2002060641A	2002-02-26
JP2003107752A	2003-04-09

Other References: