Title:
MICROLED MOUNTING STRUCTURE, MICROLED DISPLAY, AND MICROLED DISPLAY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/116207
Kind Code:
A1
Abstract:
This MicroLED mounting structure comprises: a wiring board 4 that has, on one side thereof, electrode parts 7 arranged according to a predetermined array; and a microLED 3 that is provided so as to correspond to the positions of the electrode parts 7, that emits light of a specified spectrum from the ultraviolet wavelength band to the blue wavelength band, that has, on one surface of mutually opposed surfaces thereof, electrodes 31a, 31b which are electrically connected to the electrode parts 7, and that has, on another surface thereof, a light emission surface 32 which projects emitted light. The electrodes 31a, 31b and the electrode parts 7 are bonded via a conductive, thermosetting first adhesive 6. All or part of the peripheral lateral surface of the microLED 3 is enclosed and bonded by an insulating, thermosetting second adhesive 8. The microLED 3 is fixed to the wiring board via the second adhesive 8. Due to this configuration, provided is a means for reliably bonding and electrically connecting the electrodes of the microLED to the electrode parts of the wiring board and for reliably connecting the microLED to the wiring board.
Inventors:
YANAGAWA YOSHIKATSU (JP)
HIRANO TAKAFUMI (JP)
OKURA NAOYA (JP)
HIRANO TAKAFUMI (JP)
OKURA NAOYA (JP)
Application Number:
PCT/JP2019/045816
Publication Date:
June 11, 2020
Filing Date:
November 22, 2019
Export Citation:
Assignee:
V TECH CO LTD (JP)
International Classes:
H01L33/36; G09F9/33; H01L33/48; H01L33/50; H01L33/62
Foreign References:
| JP2008027933A | 2008-02-07 | |||
| US20180233536A1 | 2018-08-16 | |||
| JP2018182282A | 2018-11-15 |
Attorney, Agent or Firm:
OGAWA, Moriaki et al. (JP)
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