Title:
MICRONEEDLE PATCH
Document Type and Number:
WIPO Patent Application WO/2022/234905
Kind Code:
A1
Abstract:
The present invention is a microneedle patch having a multi-layer structure, the microneedle patch comprising: a base; and microneedles which protrude from the surface of the base, have a plurality of layers, and have a curvature in the area where the layers touch.
Inventors:
LEE JAE JOON (KR)
JEON YI SEUL (KR)
JEON YI SEUL (KR)
Application Number:
PCT/KR2021/015024
Publication Date:
November 10, 2022
Filing Date:
October 25, 2021
Export Citation:
Assignee:
FEROKA INC (KR)
International Classes:
A61M37/00; A61K9/00
Domestic Patent References:
| WO2008130587A2 | 2008-10-30 |
Foreign References:
| KR20180096610A | 2018-08-29 | |||
| US20210023019A1 | 2021-01-28 | |||
| KR101776659B1 | 2017-09-11 | |||
| KR20190091008A | 2019-08-05 | |||
| JP2010233673A | 2010-10-21 |
Attorney, Agent or Firm:
THEWAVE IP LAW FIRM (KR)
Download PDF: