Title:
MICROPARTICLE ARRANGEMENT FILM, ELECTRICAL CONNECTION FILM, ELECTRICAL CONNECTION STRUCTURE, AND MICROPARTICLE ARRANGEMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2001/097276
Kind Code:
A1
Abstract:
A method for arranging specific microparticles at an arbitrary place of a film efficiently, readily, properly, and stably and a film where specific microparticles are thus arranged, namely, a method for arranging microparticles basically one in one hole and a microparticle arrangement film, and an electrical connection film for electrically connecting fine opposed electrodes by use of a film where conductive microparticles are arranged at an arbitrary place without leak to adjacent electrodes with high connection reliability and an electrical connection structure are disclosed. The microparticles of the microparticle arrangement film have an average particle size of 5 to 800 $g(m)m, an aspect ratio of less than 1.5, and a CV value of 10% or less are arranged. Holes having an average hole diameter of 1/2 to 2 times of the average particle size of the microparticles, an aspect ratio of less than 2, and a CV value of 20% or less are provided in arbitrary places on the surface of the film. The microparticles are arranged over or in the holes.
Inventors:
SUZUKI TATSUO (JP)
FUKUOKA MASATERU (JP)
IUCHI KENJI (JP)
FUKUOKA MASATERU (JP)
IUCHI KENJI (JP)
Application Number:
PCT/JP2001/005014
Publication Date:
December 20, 2001
Filing Date:
June 13, 2001
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
SUZUKI TATSUO (JP)
FUKUOKA MASATERU (JP)
IUCHI KENJI (JP)
SUZUKI TATSUO (JP)
FUKUOKA MASATERU (JP)
IUCHI KENJI (JP)
International Classes:
B23K3/06; H01L21/48; H01L21/56; H05K3/34; (IPC1-7): H01L21/60; H01B5/16; H01B3/00; H01R11/01
Foreign References:
| EP0954208A1 | 1999-11-03 | |||
| JP2000003621A | 2000-01-07 | |||
| JP2000100250A | 2000-04-07 |
Attorney, Agent or Firm:
Yasutomi, Yasuo (Nishinakajima 5-chome Yodogawa-ku Osaka-shi, Osaka, JP)
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