Title:
MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2022/000644
Kind Code:
A1
Abstract:
Provided is a microphone, comprising a protective structure having an accommodation space and an ASIC chip and MEMS chip accommodated in the protective structure. A sound hole penetrates the protective structure. The protective structure comprises a circuit board and an outer shell that covers the circuit board thereby forming the accommodation space. A first electromagnetic shielding film covers the surface of the ASIC chip. Compared to prior art, the microphone of the present invention can improve to a large degree the problem of electromagnetic interference on the microphone.
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Inventors:
HU HENGBIN (CN)
ZENG PENG (CN)
ZENG PENG (CN)
Application Number:
PCT/CN2020/104629
Publication Date:
January 06, 2022
Filing Date:
July 24, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R19/00
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Attorney, Agent or Firm:
SHENZHEN ZICHEN INTELLECTUAL PROPERTY AGENCY LIMITED (CN)
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