Title:
MICROWAVE CIRCUIT SUBSTRATE AND ITS PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2003/032696
Kind Code:
A1
Abstract:
A thermoplastic resin composition having a dielectric loss tangent of 0.01 or less at 1 kHz to 20 GHz, an Izot impact strength of 2 kJ&sol m or more, and a heat distortion temperature of 110 °C or more under 18.6 kgf load is formed on a substrate of a predetermined shape. A part of the surface where a conductor layer is to be formed is exposed. A mask is so formed on the substrate as to cover the other part of the surface of the substrate. The mask and the exposed part of the substrate surface from the mask are etched. A catalyst for electroless plating is given to the etched surface. The mask is removed from the substrate. A conductive layer of a predetermined pattern is formed on the substrate surface by electroless plating, thus producing a microwave circuit substrate. The microwave circuit substrate for antenna and so forth has a small voltage standing wave ratio (VSWR), undergoes little warp and distortion due to temperature variation and humidity variation, and is suitable for being incorporated in a mobile communication device such as a portable phone.
Inventors:
MINAMI KOJI (JP)
Application Number:
PCT/JP2002/010330
Publication Date:
April 17, 2003
Filing Date:
October 03, 2002
Export Citation:
Assignee:
ZEON CORP (JP)
MINAMI KOJI (JP)
MINAMI KOJI (JP)
International Classes:
C08L45/00; C08L65/00; C08L101/00; H01P11/00; H05K1/02; H05K3/18; H05K3/38; (IPC1-7): H05K1/03; H01P11/00; H05K1/02
Foreign References:
| JP2000091717A | 2000-03-31 | |||
| JPH11340593A | 1999-12-10 | |||
| JP2001244610A | 2001-09-07 | |||
| JPH1117442A | 1999-01-22 |
Attorney, Agent or Firm:
Maeda, Hitoshi (Kiriyama Bldg. 1-1 Sarugaku-cho 2-chome Chiyoda-ku, Tokyo, JP)
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