Title:
MODIFIED EPOXY ACRYLATE PREPOLYMER, PHOTO-THERMAL DUAL-CURING CONDUCTIVE ADHESIVE, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/092575
Kind Code:
A1
Abstract:
Disclosed are an organic dibasic acid modified epoxy acrylate prepolymer and a photo-thermal dual-curing conductive adhesive prepared from the modified epoxy acrylate prepolymer. The modified epoxy acrylate prepolymer is prepared in parts by mass from 45-72 parts of epoxy resin, 12-20 parts of 1,4-butanediol diglycidyl ether, 7-26 parts of organic dibasic acid, 5-15 parts of acrylic acid, and 0.26-0.45 parts of a polymerization inhibitor under the catalysis of 0.13-0.28 parts of a catalyst. The general structural formula of the organic dibasic acid is HOOC-R-COOH. The prepared modified epoxy acrylate prepolymer has an epoxy content of 3-9%, a hydroxyl content of 3-10% and a vinyl content of 2-8%. The photo-thermal dual-curing conductive adhesive of the present invention has the advantages of high bonding strength, good conductivity, good cold and hot impact resistance and photo-thermal curability, and is suitable for assembly line batch production and application in the field of electronics.
Inventors:
FENG CHAOBO (CN)
LOU XINGYUAN (CN)
LI CANGUANG (CN)
CHEN JIANJUN (CN)
HUANG HENGCHAO (CN)
LOU XINGYUAN (CN)
LI CANGUANG (CN)
CHEN JIANJUN (CN)
HUANG HENGCHAO (CN)
Application Number:
PCT/CN2021/134073
Publication Date:
June 01, 2023
Filing Date:
November 29, 2021
Export Citation:
Assignee:
GUANGZHOU BAIYUN CHEMICAL IND CO LTD (CN)
GUANGDONG BAIYUN TECH CO LTD (CN)
GUANGDONG BAIYUN TECH CO LTD (CN)
International Classes:
C08G59/14; C08G59/17; C09J9/02; C09J163/00; C09J163/10
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Attorney, Agent or Firm:
GUANGZHOU PRIME IP LAW OFFICE (CN)
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