Title:
MODIFIED EPOXY RESIN FOR SEMICONDUCTOR DEVICE ENCAPSULATION, METHOD FOR MANUFACTURING SAME, AND LIQUID RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATION EXHIBITING LOW WARPAGE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2023/140644
Kind Code:
A1
Abstract:
The present invention provides: an epoxy resin having a novolak structure containing polyalkylene glycol ether epoxy; a method for manufacturing same; and a liquid resin composition for semiconductor device encapsulation, wherein the liquid resin composition contains the epoxy resin. If a liquid resin composition for semiconductor device encapsulation is prepared using a novel epoxy resin having a novolak structure containing polyalkylene glycol ether epoxy according to the present invention, bleeding of the epoxy and a curing agent does not occur, thus making it possible to overcome the low compatibility thereof, and a high glass transition temperature and low CTE are exhibited compared to conventional semiconductor encapsulants, thus making it possible to lower internal stress and thereby effectively improve warpage to solve the problem of reliability degradation. Therefore, a lighter, thinner, and miniaturized wafer-level packaging (WLP) technology can be applied to encapsulate a highly integrated semiconductor device having a fine surface structure.
More Like This:
| WO/2017/032582 | USE OF CERTAIN POLYMERS AS A CHARGE STORE |
| JPH05117365 | EPOXY RESIN COMPOSITION FOR LAMINATED BOARD |
| JP4517433 | Epoxy resin composition and semiconductor device |
Inventors:
JEONG KEUK-MIN (KR)
KIM SEUNG-BEUM (KR)
CHOI JANG-RAK (KR)
SIM HAN-UL (KR)
KIM SEUNG-BEUM (KR)
CHOI JANG-RAK (KR)
SIM HAN-UL (KR)
Application Number:
PCT/KR2023/000940
Publication Date:
July 27, 2023
Filing Date:
January 19, 2023
Export Citation:
Assignee:
EVERTECH ENTPR CO LTD (KR)
International Classes:
C08G59/24; C08G59/42; C08G59/62; C08L63/04; H01L23/29
Foreign References:
| JP2699885B2 | 1998-01-19 | |||
| KR20210127793A | 2021-10-22 | |||
| JP2013108011A | 2013-06-06 | |||
| JPH07118505A | 1995-05-09 | |||
| JP2008218496A | 2008-09-18 |
Attorney, Agent or Firm:
KONG, Byung Wook (KR)
Download PDF:
Previous Patent: FACE AIR CURTAIN FORMING DEVICE
Next Patent: METHOD FOR PROCESSING MEDIA DATA AND DEVICE FOR PROCESSING MEDIA DATA
Next Patent: METHOD FOR PROCESSING MEDIA DATA AND DEVICE FOR PROCESSING MEDIA DATA