Title:
MODULE ARRANGEMENT METHOD FOR CHIP AND RELATED DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/185917
Kind Code:
A1
Abstract:
The present application relates to the field of chip layout, and discloses a module arrangement method for a chip. The method comprises: obtaining a first constraint of a plurality of circuit modules of a target chip; according to a first target, arranging the plurality of circuit modules in the target chip to obtain a first chip arrangement, wherein during arrangement, the first constraint is used as a soft constraint of the plurality of circuit modules; and according to a second target, using the first constraint as a hard constraint of an arrangement between the plurality of circuit modules, and adjusting the arrangement of the plurality of circuit modules in the first chip arrangement to obtain a second chip arrangement. The present application uses the first constraint as the soft constraint for primary chip arrangement, then uses the first constraint as the hard constraint, and finely adjusts a chip arrangement result, so that when the length of a wire between the circuit modules is optimized, it can be ensured that an arrangement result satisfies a given constraint of chip design.
Inventors:
KAI SHIXIONG (CN)
PUI CHAK WA (CN)
WANG BIN (CN)
JIANG SHOUGAO (CN)
HUANG YU (CN)
PUI CHAK WA (CN)
WANG BIN (CN)
JIANG SHOUGAO (CN)
HUANG YU (CN)
Application Number:
PCT/CN2023/084664
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06F30/392
Foreign References:
| CN101339571A | 2009-01-07 | |||
| CN115202661A | 2022-10-18 | |||
| CN111539166A | 2020-08-14 | |||
| US10614191B1 | 2020-04-07 | |||
| US20170132350A1 | 2017-05-11 |
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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