Title:
MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/195451
Kind Code:
A1
Abstract:
The present invention provides a module, equipped with: a semiconductor component, equipped with a semiconductor layer having an electrode provided on the upper surface thereof, and a protective film provided on the semiconductor layer, the protective film having a first opening exposing the electrode; a resin insulation layer provided on the protective film, the resin insulation layer having a second opening, which exposes the electrode and which is larger than the first opening; an adhesive bonding the protective film and the resin insulation layer, the adhesive having a third opening exposing the electrode; and a metal layer provided on the resin insulation layer, the metal layer embedding the first opening, the second opening, and the third opening, and connecting with the electrode.
Inventors:
KAWASHIMA TASUKU (JP)
Application Number:
PCT/JP2020/007331
Publication Date:
October 01, 2020
Filing Date:
February 25, 2020
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01L23/12; H05K3/28
Foreign References:
| JP2009064914A | 2009-03-26 | |||
| JP2012227444A | 2012-11-15 | |||
| JP2012023409A | 2012-02-02 | |||
| JP2002064162A | 2002-02-28 | |||
| JP2006286690A | 2006-10-19 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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